Chiplet Summit 2026
Chiplet Summit 2026 will take place February 17–19 in Santa Clara, California. QuickLogic will exhibit at Booth #416, where attendees can learn how its eFPGA IP and eFPGA-based chiplets enable flexible, scalable architectures for advanced heterogeneous integration.
In addition, QuickLogic will present a technical session titled:
"Enabling Flexible Heterogeneous Integration with an eFPGA Chiplet on Intel® 18A"
The presentation will be delivered by Trey Peterson, Applications Engineer at QuickLogic, during Session E-202 on Thursday, February 19, from 3:00 p.m. to 4:20 p.m. The session will explore how eFPGA chiplets can be used to add post-silicon adaptability and extend platform flexibility in advanced process nodes.
Chiplet Summit 2026 Exhibit Hours
- Wednesday, February 18: 12:30 p.m. – 8:00 p.m.
- Thursday, February 19: 12:00 p.m. – 3:00 p.m.
QuickLogic Booth: 416