Events

Upcoming Events

Sep 20, 2017
8:00 AM - 5:00 PM PT

GLOBALFOUNDRIES Technology Conference
Location: Hyatt Regency, Santa Clara, CA

QuickLogic Corporation (NASDAQ:QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, display bridge and programmable logic solutions, will be demonstrating its ArcticPro™ eFPGA solutions at the GLOBALFOUNDRIES Technology Conferences in Santa Clara, California, Munich and Shanghai.

QuickLogic's ultra-low power embedded FPGA (eFPGA) architecture and mature software offer SoC designers an easy-to-integrate, highly reliable and extremely low power approach to integrating programmable logic into their devices.  The ArcticPro 2 technology is the industry's first and only eFPGA offering for the GLOBALFOUNDRIES' FD-SOI process. With the availability of the ArcticPro 2 eFPGA on 22FDX® FD-SOI, customers can now greatly reduce their time-to-market and R&D costs and begin generating revenue faster when targeting fragmented markets such as IoT, where requirements are rapidly evolving and new features and standards are still emerging. 



Oct 13, 2017
7:30 AM
Email

GLOBALFOUNDRIES Technology Conference

Email Reminder

Please sign up for email alert notification.


GLOBALFOUNDRIES Technology Conference
Location: Sofitel Bayerpost, Munich, Germany

QuickLogic Corporation (NASDAQ:QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, display bridge and programmable logic solutions, will be demonstrating its ArcticPro™ eFPGA solutions at the GLOBALFOUNDRIES Technology Conferences in Santa Clara, California, Munich and Shanghai.

QuickLogic's ultra-low power embedded FPGA (eFPGA) architecture and mature software offer SoC designers an easy-to-integrate, highly reliable and extremely low power approach to integrating programmable logic into their devices.  The ArcticPro 2 technology is the industry's first and only eFPGA offering for the GLOBALFOUNDRIES' FD-SOI process. With the availability of the ArcticPro 2 eFPGA on 22FDX® FD-SOI, customers can now greatly reduce their time-to-market and R&D costs and begin generating revenue faster when targeting fragmented markets such as IoT, where requirements are rapidly evolving and new features and standards are still emerging.



Oct 23, 2017
Email

GLOBALFOUNDRIES Technology Conference

Email Reminder

Please sign up for email alert notification.


GLOBALFOUNDRIES Technology Conference
Location: Jumeirah Hotel, Shanghai, China

QuickLogic Corporation (NASDAQ:QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, display bridge and programmable logic solutions, will be demonstrating its ArcticPro™ eFPGA solutions at the GLOBALFOUNDRIES Technology Conferences in Santa Clara, California, Munich and Shanghai.

QuickLogic's ultra-low power embedded FPGA (eFPGA) architecture and mature software offer SoC designers an easy-to-integrate, highly reliable and extremely low power approach to integrating programmable logic into their devices.  The ArcticPro 2 technology is the industry's first and only eFPGA offering for the GLOBALFOUNDRIES' FD-SOI process. With the availability of the ArcticPro 2 eFPGA on 22FDX® FD-SOI, customers can now greatly reduce their time-to-market and R&D costs and begin generating revenue faster when targeting fragmented markets such as IoT, where requirements are rapidly evolving and new features and standards are still emerging. 



Past Events

Sep 6, 2017
Drexel Hamilton Telecom, Media & Technology Conference
Speaker: Dr. Sue Cheung , VP of Finance and CFO
Location: New York City, New York

Dr. Sue Cheung, the company's VP of Finance and CFO, will host one-on-one meetings throughout the day. To schedule a meeting, please contact Lynn Orenstein, Head of Corporate Access, lorenstein@drexelhamilton.com or quicklogic@lhai.com.



Jun 28–29, 2017
Sensors Expo & Conference
Location: San Jose, California

Booth Demonstration
When: Wednesday, June 28 - Thursday, June 29
Where: Booth 1230 at San Jose McEnery Convention Center
What: QuickLogic will demonstrate always-on always listening, wake-on voice recognition (including Sensory "TrulyHandsfree™ Voice demo") utilizing the QuickLogic EOS™ S3 ultra-low power sensor processing platform.

For more information about the conference, please visit www.sensorsexpo.com.



Jun 19–21, 2017
DAC 2017

Booth Demonstration 
When:
 Monday, June 19 - Wednesday, June 2110am - 6pm
Where: QuickLogic booth number 2015
What: QuickLogic will demonstrate how its newest ArcticPro eFPGA technology is enabling developers to create SoC and ASIC platforms that can easily be tailored to serve multiple target applications. The company will also demonstrate how ultra-low power sensor fusion is implemented on an eFPGA to offload the CPU to maximize battery life and improve performance with standby current as low as 30uA and active power consumption of 125uA.

Panel
Who:
 Tim SaxeQuickLogic's CTO
Title: "Minimizing IC Power Consumption: Top Down or Bottom up Design Methodology. What is the Starting Point?" - http://www2.dac.com/events/eventdetails.aspx?id=223-9
When: Monday, June 193:30pm - 5:00pm
Where: Ballroom G

Presentation
Who:
 Mao Wang, eFPGA Product Marketing Director
What: This presentation will outline the reasons why eFPGA IP is an ideal solution to address IoT and other fragmented markets. It's inherent post-fabrication flexibility delivers lower overall product costs, the ability to add or modify features and increase product differentiation. 
Where: SMIC Booth # 1713

For more information, conference program schedules and exhibit hours, please visit https://dac.com



May 31, 2017
14th Annual Craig-Hallum Institutional Investor Conference
Speaker: Brian Faith, President and CEO, and Dr. Sue Cheung CFO
Location: Minneapolis

President and CEO Brian Faith and Dr. Sue Cheung, the company's VP of Finance and CFO, will host one-on-one meetings throughout the day. To schedule a meeting, please contact your Craig-Hallum representative, or Cathy Mattison of LHA Investor Relations at quicklogic@lhai.com.



May 9, 2017
8:30 AM
SMIC Advanced Technology Workshop 2017


Apr 18, 2017
8:30 AM PT
SMIC Advanced Technology Workshop 2017
Location: Mission City Ballroom B1-B5, Santa Clara Convention Center

Apr 13, 2017
8:30 AM
SMIC Advanced Technology Workshop 2017
Location: 3F Shanghai Hall, Kerry Hotel Pudong Shanghai

Apr 7, 2017
IoT Summit 2017
Speaker: Tim Saxe, CTO

Keynote: Solving the SoC Design Dilemma for IoT Applications with Embedded FPGA

There are significant device design challenges posed by the large but highly fragmented IoT market. In terms of traditional parameters, cost, power, and time to market are the most critical. An ideal solution to this dilemma is to embed low power FPGA technology into SoCs. The SoC provides a high level of integration to reduce cost and the embedded FPGA provides low power consumption and the ability to make post-production design changes for fast time-to-market. This presentation will discuss how SoC developers can deliver highly differentiated products for IoT applications quickly and cost effectively through the use of Embedded FPGA technology.  

 



Mar 14, 2017
11:00 AM PT
Speaker: Brian Faith , President and CEO
Location: Dana Point, California

Mr. Faith and Dr. Sue Cheung, the company's VP of Finance and CFO, will be available for one-on-one meetings throughout the day. Interested investors should contact their ROTH representative, or Cathy Mattison of LHA Investor Relations at quicklogic@lhai.com.



Mar 7–8, 2017
Wearable Technology Show
Location: London

Presentation:
What if Your House Understood You?
Speaker: Dr. Tim Saxe, CTO
March 8 at 2:25 p.m., Smart Home Track

Panel:
Topic: Advanced Sensors
Panelists: Andy Green, QuickLogic's Senior Director, Strategic Marketing will be joined by Craige Palmer, General Sales Manager, Hamamatsu Photonics and David Lussey, Non-Executive Board Member, Infi-Tex.
Moderator: James Moar, Senior Analyst, Juniper Research
March 7 at 1:30 p.m.

Demonstration:
Stand K50, Smart Home of the Future
March 7 and 8, 2017 from 9:00 a.m. - 5:30 p.m.
A voice-enabled home automation system using Sensory's "Alexa" voice-trigger running on QuickLogic's EOS™ S3 Sensor Processing Solution.
For more information about the conference, please visit http://www.wearabletechnologyshow.net/home



Feb 15, 2017
2:30 PM PT

The dial-in number for the live audio call is (877) 377-7094. A recording will be available starting one hour after the completion of the call. To access the recording, please call (404) 537-3406 and use the passcode 50904830. The call recording will be archived until Wednesday, February 22, 2017, and the webcast will be available for 12 months.



Jan 5–8, 2017
CES 2017

Panel Discussion
Thursday, January 5, 11:30 a.m. - 12:30 p.m., Venetian, Level 4, Marcello 4501
Where are Consumer Electronics Taking the Sensors Industry?

QuickLogic Hospitality Suite 
Venetian Towers, Floor 31, suite 310 and 312

Please email info@quicklogic.com to set up a meeting

MEMS & Sensor Industry Group – QuickLogic Booth
Booth 40736 (Smart Home), Sands Convention Center, Level 2 



Presentations

Oct 23, 2017
Email

GLOBALFOUNDRIES Technology Conference

Email Reminder

Please sign up for email alert notification.


GLOBALFOUNDRIES Technology Conference
Location: Jumeirah Hotel, Shanghai, China

QuickLogic Corporation (NASDAQ:QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, display bridge and programmable logic solutions, will be demonstrating its ArcticPro™ eFPGA solutions at the GLOBALFOUNDRIES Technology Conferences in Santa Clara, California, Munich and Shanghai.

QuickLogic's ultra-low power embedded FPGA (eFPGA) architecture and mature software offer SoC designers an easy-to-integrate, highly reliable and extremely low power approach to integrating programmable logic into their devices.  The ArcticPro 2 technology is the industry's first and only eFPGA offering for the GLOBALFOUNDRIES' FD-SOI process. With the availability of the ArcticPro 2 eFPGA on 22FDX® FD-SOI, customers can now greatly reduce their time-to-market and R&D costs and begin generating revenue faster when targeting fragmented markets such as IoT, where requirements are rapidly evolving and new features and standards are still emerging. 



Oct 13, 2017
7:30 AM
Email

GLOBALFOUNDRIES Technology Conference

Email Reminder

Please sign up for email alert notification.


GLOBALFOUNDRIES Technology Conference
Location: Sofitel Bayerpost, Munich, Germany

QuickLogic Corporation (NASDAQ:QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, display bridge and programmable logic solutions, will be demonstrating its ArcticPro™ eFPGA solutions at the GLOBALFOUNDRIES Technology Conferences in Santa Clara, California, Munich and Shanghai.

QuickLogic's ultra-low power embedded FPGA (eFPGA) architecture and mature software offer SoC designers an easy-to-integrate, highly reliable and extremely low power approach to integrating programmable logic into their devices.  The ArcticPro 2 technology is the industry's first and only eFPGA offering for the GLOBALFOUNDRIES' FD-SOI process. With the availability of the ArcticPro 2 eFPGA on 22FDX® FD-SOI, customers can now greatly reduce their time-to-market and R&D costs and begin generating revenue faster when targeting fragmented markets such as IoT, where requirements are rapidly evolving and new features and standards are still emerging.



Sep 20, 2017
8:00 AM - 5:00 PM PT

GLOBALFOUNDRIES Technology Conference
Location: Hyatt Regency, Santa Clara, CA

QuickLogic Corporation (NASDAQ:QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, display bridge and programmable logic solutions, will be demonstrating its ArcticPro™ eFPGA solutions at the GLOBALFOUNDRIES Technology Conferences in Santa Clara, California, Munich and Shanghai.

QuickLogic's ultra-low power embedded FPGA (eFPGA) architecture and mature software offer SoC designers an easy-to-integrate, highly reliable and extremely low power approach to integrating programmable logic into their devices.  The ArcticPro 2 technology is the industry's first and only eFPGA offering for the GLOBALFOUNDRIES' FD-SOI process. With the availability of the ArcticPro 2 eFPGA on 22FDX® FD-SOI, customers can now greatly reduce their time-to-market and R&D costs and begin generating revenue faster when targeting fragmented markets such as IoT, where requirements are rapidly evolving and new features and standards are still emerging. 



Sep 14, 2017

Design and Reuse IP-SoC Days
Location: Evergreen Laurel Hotel Shanghai, No. 1136, Zu Chongzhi Road, Shanghai

Presentation
Who: Itsu Wang, Senior Director, Asia Sales and Marketing
What: Innovation & Differentiation for your SoC…with embedded FPGA Technology
This presentation will outline the reasons why eFPGA IP is an ideal solution to address IoT and other fragmented markets. With QuickLogic's ArcticPro™ eFPGA, chip designers can now easily customize their products post production to serve multiple applications.
When: September 14, 2017 at 2:00 p.m.
Where: Evergreen Laurel Hotel Shanghai, No. 1136, Zu Chongzhi Road, Shanghai

Demonstration
What: QuickLogic will demonstrate ArcticPro™ eFPGA capabilities and how it can improve overall system performance and flexibility while extending battery life and reducing product life-cycle costs.
When: September 14 from 9:00 a.m. to 5:00 p.m.

For more information, please visit 
http://www.design-reuse-embedded.com/ipsocdays/shanghai2017.jsp



Sep 13, 2017
8:30 AM PT

2017 SMIC Technology Symposium
Location: 3F Shanghai Hall, Kerry Hotel Pudong, Shanghai

QuickLogic will demonstrate its ArcticPro™ eFPGA (embedded FPGA) IP evaluation board on the SMIC 40LL process. The ArcticPro eFPGA in the SMIC 40LL process gives designers the ability to add a high degree of post manufacturing design flexibility and enables them to address fragmented and/or rapidly evolving standards with a single device at extremely low power.



Jun 27, 2017

Reach China Investment Conference
Speaker: Brian Faith, President and CEO, and Dr. Sue Cheung CFO
Location: Beijing

May 31, 2017

14th Annual Craig-Hallum Institutional Investor Conference

President and CEO Brian Faith and Dr. Sue Cheung, the company's VP of Finance and CFO, will host one-on-one meetings throughout the day. To schedule a meeting, please contact your Craig-Hallum representative, or Cathy Mattison of LHA Investor Relations at quicklogic@lhai.com.



Related Information

Annual Reports

Quarterly Results

Key Ratios

= add file to Briefcase