When:Monday, June 19 - Wednesday, June 21, 10am - 6pm Where: QuickLogic booth number 2015 What:QuickLogic will demonstrate how its newest ArcticPro eFPGA technology is enabling developers to create SoC and ASIC platforms that can easily be tailored to serve multiple target applications. The company will also demonstrate how ultra-low power sensor fusion is implemented on an eFPGA to offload the CPU to maximize battery life and improve performance with standby current as low as 30uA and active power consumption of 125uA.
Who:Mao Wang, eFPGA Product Marketing Director What: This presentation will outline the reasons why eFPGA IP is an ideal solution to address IoT and other fragmented markets. It's inherent post-fabrication flexibility delivers lower overall product costs, the ability to add or modify features and increase product differentiation. Where: SMIC Booth # 1713
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